Heat Sinks are installed inside packages
in order to discharge the heat generated
inside memory chips or diode chips to
Chips can be thermally
stabilized and can exert their functions
continuously only when the heat generated
inside or around the chips is easily discharged.
Therefore, heat proof materials should be
harmonized with surrounding materials
in thermal characteristics.
Heat proof materials are selected based
on the calorific values of generated heat
and surrounding materials.
Recently, polymer heat proof materials
are being developed and Seung Lim
Electric Co., Ltd. is also
conducting the R&D of these materials
in response to the requirement of the